Thin silver films have many important potential applications but are not presently well understood. Using scanning electron microscopy and electron backscatter diffraction (EBSD)
mapping, the microstructure silver films created with a range of different thicknesses, titanium adhesion layers, and annealing temperatures, have been analyzed.
Publisher
Cornell Center for Materials Research
Date
2007-08-29
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Additional Notes
Support for the CCMR is provided through the NSF Grant DMR 0520404, part of the NSF MRSEC Program. Additional support is provided by Cornell University, the State of New York, and
by industrial sources.