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View Generic Document: Using thickness variation and interface chemistry to manipulate microstructure in thin Silver films

Citation: Ballard, Daniel (2007). Using thickness variation and interface chemistry to manipulate microstructure in thin Silver films. Cornell Center for Materials Research.
Collection: Cornell Center for Materials Research REU Program  
 
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Title Using thickness variation and interface chemistry to manipulate microstructure in thin Silver films
Author(s) Ballard, Daniel
Keyword(s) thin silver films
thin films
thin metal films
thickness
orientation
Ag
Abstract/Summary When thin Silver films (nominally 100nm to 2000nm) are thermally cycled, the resulting microstructure has a preferred orientation dependent on thickness. There may be nominal dependency on an interface layer of Ti, but that is yet to be determined conclusively. When the Ag is at a thickness of about 1 μm, the texture starts to change from predominantly (111) orientation to predominantly (100) orientation. When the thickness reaches about 1.5 μm, the volume fraction of (100) orientation to (111) approaches 90- 95% and continues to rise to values of 98% or more at thicknesses ≥ 2μm
Publisher Cornell Center for Materials Research
Date 2007-08-29
Copyright Notice Copyright 2007 CCMR. Materials from the CCMR website may not be used without permission.
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Additional Notes Support for the CCMR is provided through the NSF Grant DMR 0520404, part of the NSF MRSEC Program. Additional support is provided by Cornell University, the State of New York, and by industrial sources.
 
 
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Created: Fri, 18 Jan 2008, 06:36:11 EST by Cathy Lowe. Detailed History


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