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View Journal Article: High Frequency Input Impedance Characterization of Dielectric Films for Power-Ground Planes

Citation: Obrzut, J. and Anopchenko, O. (2003). High Frequency Input Impedance Characterization of Dielectric Films for Power-Ground Planes. IEEE Transactions on Instrumentation and Measurement 52 (4). 1120-1124.
Collection: Polymer Publications  
 
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Title High Frequency Input Impedance Characterization of Dielectric Films for Power-Ground Planes
Author(s) Obrzut, J.
Anopchenko, O.
Keyword(s) decoupling capacitance
dielectric relaxation
dielectric resonators
HFSS modeling
high-k composite
microwave measurements
Abstract/Summary Broadband impedance characterization of high dielectric constant (high-k) films was performed using a coaxial test fixture configuration. The presented coaxial test fixture and broadband measurement methodology of impedance for high-k films minimizes systematic uncertainties by reducing the interconnection inductance and improving the calibration procedure. In the APC-7 configuration, the technique enables accurate evaluation of impedance at frequencies of 100 MHz to 10 GHz with resolution of 0.01 . The electrical characteristic of high-k films was found to be consistent with a capacitive load without significant contribution from the circuit inductance that typically dominates the high-frequency response. The experimental data and numerical simulations showed that high-k organic-ceramic composite materials could considerably suppress resonant behavior of the power-ground planes. It was found that high-k organic resins filled with ferroelectric ceramic powders exhibit a high-frequency dielectric loss that increases with increasing volume fraction of the ceramic component. The dielectric dispersion and the corresponding dielectric loss of organic-ceramic hybrid materials can serve as an effective mechanism for suppressing the resonant standing waves in power-ground planes.
Publisher IEEE
Date 2003-01-01
Copyright Notice Array
Journal IEEE Transactions on Instrumentation and Measurement
Volume 52
Pages 1120-1124
Issue 4
Copyright Agreement on
Additional Notes IEEE Transactions on Instrumentation and Measurement 2003; 52(4): 1120-1124; Sponsorship: This work was supported in part by the NIST MSEL Director’s Reserve Funds.
 
 
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