Calculate temperature profile and Biot number in mixed conduction and convection/radiation heat transfer from liquid metal through a ceramic mold to the environment, and suggest a
design change to reduce the probability of shattering due to thermal stress.
Date
2004-12-15
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Copyright: 1999, 2000, 2001, 2004 Adam C. Powell, IV; http://ocw.mit.edu/OcwWeb/Global/terms-of-use.htm