View Generic Document: Investigating Mechanical Properties of Thin Films via Nanoindentation
Citation:
Griggs, Cornelius (2005). Investigating Mechanical Properties of Thin Films via Nanoindentation. National Institute of Standards and Technology, Technology Administration, U.S. Department of Commerce..
Knowledge of the mechanical properties of thin films, particularly silicon-based films, is important for many important applications, including semi-conductors and MEMS. Little is
known about the changes in mechanical properties as the size of the material sample is reduced, yet these properties are crucial for device reliability. In our work, nanoindentation is used to
investigate basic material properties of oxide and nitride thin films on silicon substrates. Modulus, hardness, residual stress, and strength are studied. Equations have been developed to
deconvolute film properties from tests on film substrate bilayers. Crack lengths resulting from nanoindentation are measured using AFM and are then used to predict film residual stress. The effects
of temperature, deposition power, pressure, and deposition temperature are compared. Films fabricated at lower temperatures tend to have lower modulus and hardness due to a lower density, though
power and vacuum are also important factors. This method can be used to find optimal processing conditions to produce optical mechanical properties, for instance films that are strong with low
residual stress.
Publisher
National Institute of Standards and Technology, Technology Administration, U.S. Department of Commerce.
Guest - January 07, 2009
View Generic Document: Investigating Mechanical Properties of Thin Films via Nanoindentation 